| THURSDAY - March 16th 2006 |
| 18.00 - 20.00 |
Conference Registration at the Salzburg Congress |
20.00 -
22.00 |
Reception at the Salzburg Congress |
| FRIDAY - March 17th 2006 |
| 08.00 - 08.45 |
Conference Registration at the Salzburg Congress |
| |
GENERAL SESSION |
08.45 -
09.00
|
Introduction
Ken Braney, Chairman ETD
Reinhold Plot, Conference Chairman
|
| 09.00 - 09.45 |
Market Development through Innovation
Jason Rowe, Lotus, UK
|
| 09.45 - 10.30 |
Technological Assets create Company Wealth
Gijs Paauwe / former-president SPE Benelux, Netherlands
|
| 10.30 - 11.00 |
Break |
| 11.00 - 12.30 |
The Passion Chain
Guido Thys, Netherlands, Keynote Speaker:
|
| 12.30 - 14.00 |
Lunch |
| |
TECHNICAL SESSION |
14.00 -
15.30 |
New Method for continuously Processing:
Monitoring the Thermoforming Sheet
Temperature
Stefan Stolze, Raytek, Germany
Fuel Tank Developments
Francesco Fiorentini, Cannon, Italy
|
| 15.30 - 16.00 |
Break |
16.00-
17.30 |
Modified Atmosphere Packaging
Uwe Heer, Kiefel AG,Germany
(R)EVOLUTION of Automated Thermoforming Production
Heinrich Rudholzer, Germany
|
| 17.30 |
End |
| |
COMMERCIAL SESSION
|
14.00 -
15.30 |
The 7 Ways of Processing:
Waste or Profit
Steve Williamson, SJW Associates Ltd., UK
The Plastics Future Market
Peter Davis, BPF, UK
|
| 15.30 - 16.00 |
Break |
| 16.00 - 17.30 |
Recent Trends -
International Competitiveness
Walter Scherrer, Salzburg University, Austria
Managing in Era of Great and Accelerating Change
Roger Jones, Franklin Intl, USA
|
| 17.30 |
End |
| 20.00 |
Dinner at Stieglkeller |
| SATURDAY - March 18th 2006 |
| 08.30 - 10.15 |
WORKSHOP I
Working Practice
(Regulations, Responsibilities)
Tony Hoyland, UK & Thomas Wittich / TUV, Austria |
| 08.30 - 10.15 |
WORKSHOP II
Design
Rob Crins & Jeroen op ten Berg, GBO Design-Eng, Netherlands |
10.15 -
10.45 |
Break |
| 10.45-12.30 |
WORKSHOP III
T-FORM
Ing. Josef Seidl,Seidl Tec, Austria &
Marco Smit TNO, NL |
10.45-12.30
|
Workshop IV
Higher Quality — Lower Costs
The new generation of Extrusion and Thermoforming
Christian Schade, Basf & Martin Barth, Illig & Peter Rieg, Battenfeld, Germany
|
| 12.30 - 14.00 |
Lunch |
| |
PRESENTATIONS
|
14.00-
14.45 |
Packaging Developments
Henry Heil, Nokia, USA |
| 14.45 - 15.30 |
Developments in Exterior Automotive Body Parts
Werner Pamminger, Kunststoff Cluster, Austria, Christian Pilz, Rosenbauer, Austria
|
15.30-
16.00 |
Break |
16.00-
16.45 |
Thermoforming of microstructures for chip-sized life sciences applications
Roman Truckenmüller & Stefan Giselbrecht, Forschungszentrum Karlsruhe, Germany
|
16.45-
17.00 |
Close Remarks
Ken Braney, Chairman ETD
Reinhold Plot, Conference Chairman ETD
|
| 17.00 |
End
|